HiSilicon Kirin 810 VS Qualcomm Snapdragon 778G

Comparison of video cards HiSilicon Kirin 810 vs Qualcomm Snapdragon 778G in benchmarks and specifications.

Differences Specifications Benchmarks

Differences

Top features of HiSilicon Kirin 810

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Top features of Qualcomm Snapdragon 778G

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Higher turbo clock speed

2.40 GHz 2.20 GHz

Around 8 % better overclocked clock speed

Specifications

Complete list of technical specifications

HiSilicon Kirin 810 Qualcomm Snapdragon 778G

CPU generation and family

Let's find out which one of HiSilicon Kirin 810 and Qualcomm Snapdragon 778G is of a more recent generation, and what segment it belongs to.

Specification	Value
Name	HiSilicon Kirin 810 Qualcomm Snapdragon 778G
Segment	Mobile Mobile
Family	HiSilicon Kirin Qualcomm Snapdragon
Generation	6 4
CPU group	HiSilicon Kirin 810/820 Qualcomm Snapdragon 778

CPU Cores and Base Frequency

In this block we are going to compare HiSilicon Kirin 810 vs Qualcomm Snapdragon 778G by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

Specification	Value
Frequency	1.90 GHz 1.90 GHz
CPU Cores	8 8
Turbo (1 Core)	2.20 GHz 2.40 GHz
CPU Threads	8 8
Turbo (8 Cores)	2.20 GHz 2.20 GHz
Hyperthreading	No No
Overclocking	No No
Core architecture	hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
A core	2x Cortex-A76 1x Kryo 670 Prime
B core	6x Cortex-A55 3x Kryo 670 Gold
C core	-- 4x Kryo 670 Silver

Internal Graphics

Common specifications for integrated graphics cards in HiSilicon Kirin 810 and Qualcomm Snapdragon 778G along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

Specification	Value
GPU name	ARM Mali-G52 MP6 Qualcomm Adreno 642L
GPU frequency	0.85 GHz
GPU (Turbo)	No turbo No turbo
Execution units	16 4
Shader	288 384
Max. GPU Memory	4 GB 4 GB
Max. displays	2 1
Generation	Bifrost 2 5
DirectX Version	12 12.0
Technology	12 nm 6 nm
Release date	Q1/2018 Q2/2021

Hardware codec support

Let's compare the support of video codecs between HiSilicon Kirin 810 and Qualcomm Snapdragon 778G. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

Specification	Value
h265 / HEVC (8 bit)	Decode / Encode Decode / Encode
h265 / HEVC (10 bit)	Decode / Encode Decode / Encode
h264	Decode / Encode Decode / Encode
VP9	Decode / Encode Decode / Encode
VP8	Decode / Encode Decode / Encode
AV1	No No
AVC	Decode / Encode Decode
VC-1	Decode / Encode Decode
JPEG	Decode / Encode Decode / Encode

Memory & PCIe

To choose the best model between HiSilicon Kirin 810 and Qualcomm Snapdragon 778G you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

Specification	Value
Memory type	LPDDR4X-2133 LPDDR4X-2133
Max. Memory	6 GB 16 GB
ECC	No No
Memory channels	4 2

Encryption

AES-NI encryption support for CPUs HiSilicon Kirin 810 and Qualcomm Snapdragon 778G.

Specification	Value
AES-NI	No No

Thermal Management

Let's find out what TDP value would be better for HiSilicon Kirin 810 or Qualcomm Snapdragon 778G? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Specification	Value
TDP (PL1)	5 W

Technical details

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 810 and Qualcomm Snapdragon 778G CPUs along with a list of ISA extensions.

Specification	Value
Instruction set (ISA)	ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
Virtualization	None None
L3-Cache	1.00 MB 2.00 MB
Architecture	Cortex-A76 / Cortex-A55 Kryo 670
Technology	7 nm 6 nm
Socket	N/A N/A
Release date	Q2/2019 Q2/2021
Part Number	-- SM7325