HiSilicon Kirin 970
Qualcomm Snapdragon 778G
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Comparing HiSilicon Kirin 970 vs Qualcomm Snapdragon 778G

Comparison of video cards HiSilicon Kirin 970 vs Qualcomm Snapdragon 778G in benchmarks and specifications.

Differences

HiSilicon Kirin 970

Top features of HiSilicon Kirin 970

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Qualcomm Snapdragon 778G

Top features of Qualcomm Snapdragon 778G

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  • Higher clock speed
    1.90 GHz left arrow 1.84 GHz
    Around 3% better clock speed

Specifications

Complete list of technical specifications

CPU generation and family

Let's find out which one of HiSilicon Kirin 970 and Qualcomm Snapdragon 778G is of a more recent generation, and what segment it belongs to.

Specification Value
Name HiSilicon Kirin 970 left arrow Qualcomm Snapdragon 778G
Segment Mobile left arrow Mobile
Family HiSilicon Kirin left arrow Qualcomm Snapdragon
Generation 6 left arrow 4
CPU group HiSilicon Kirin 970 left arrow Qualcomm Snapdragon 778

CPU Cores and Base Frequency

In this block we are going to compare HiSilicon Kirin 970 vs Qualcomm Snapdragon 778G by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

Specification Value
Frequency 1.84 GHz left arrow 1.90 GHz
CPU Cores 8 left arrow 8
Turbo (1 Core) 2.40 GHz left arrow 2.40 GHz
CPU Threads 8 left arrow 8
Turbo (8 Cores) 2.40 GHz left arrow 2.20 GHz
Hyperthreading No left arrow No
Overclocking No left arrow No
Core architecture hybrid (big.LITTLE) left arrow hybrid (Prime / big.LITTLE)
A core 4x Cortex-A73 left arrow 1x Kryo 670 Prime
B core 4x Cortex-A53 left arrow 3x Kryo 670 Gold
C core -- left arrow 4x Kryo 670 Silver

Internal Graphics

Common specifications for integrated graphics cards in HiSilicon Kirin 970 and Qualcomm Snapdragon 778G along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

Specification Value
GPU name ARM Mali-G72 MP12 left arrow Qualcomm Adreno 642L
GPU frequency 0.75 GHz left arrow
GPU (Turbo) No turbo left arrow No turbo
Execution units 12 left arrow 4
Shader 192 left arrow 384
Max. GPU Memory 2 GB left arrow 4 GB
Max. displays 1 left arrow 1
Generation Bifrost 2 left arrow 5
DirectX Version 12 left arrow 12.0
Technology 16 nm left arrow 6 nm
Release date Q3/2017 left arrow Q2/2021

Hardware codec support

Let's compare the support of video codecs between HiSilicon Kirin 970 and Qualcomm Snapdragon 778G. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

Specification Value
h265 / HEVC (8 bit) Decode / Encode left arrow Decode / Encode
h265 / HEVC (10 bit) Decode / Encode left arrow Decode / Encode
h264 Decode / Encode left arrow Decode / Encode
VP9 Decode / Encode left arrow Decode / Encode
VP8 Decode / Encode left arrow Decode / Encode
AV1 No left arrow No
AVC Decode / Encode left arrow Decode
VC-1 Decode / Encode left arrow Decode
JPEG Decode / Encode left arrow Decode / Encode

Memory & PCIe

To choose the best model between HiSilicon Kirin 970 and Qualcomm Snapdragon 778G you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

Specification Value
Memory type LPDDR4X-2133 left arrow LPDDR4X-2133
Max. Memory 8 GB left arrow 16 GB
ECC No left arrow No
Memory channels 4 left arrow 2

Encryption

AES-NI encryption support for CPUs HiSilicon Kirin 970 and Qualcomm Snapdragon 778G.

Specification Value
AES-NI No left arrow No

Thermal Management

Let's find out what TDP value would be better for HiSilicon Kirin 970 or Qualcomm Snapdragon 778G? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Specification Value
TDP (PL1) 9 W left arrow

Technical details

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 970 and Qualcomm Snapdragon 778G CPUs along with a list of ISA extensions.

Specification Value
Instruction set (ISA) ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
Virtualization None left arrow None
L3-Cache 2.00 MB left arrow 2.00 MB
Architecture Cortex-A73 / Cortex-A53 left arrow Kryo 670
Technology 10 nm left arrow 6 nm
Socket N/A left arrow N/A
Release date Q3/2017 left arrow Q2/2021
Part Number -- left arrow SM7325

Devices using this processor

List of devices based on HiSilicon Kirin 970 and Qualcomm Snapdragon 778G.

Specification Value
Used in Huawei Honor 10Huawei Note 10Huawei PlayHuawei Honor View 10Huawei Mate 10 ProHuawei P20Huawei Nova 3Huawei Nova 4 left arrow Unknown

Benchmarks

Real tests HiSilicon Kirin 970 vs Qualcomm Snapdragon 778G

Geekbench 5, 64bit (Single-Core)

Geekbench 5 benchmark is the newest software suit.

Geekbench 5, 64bit (Multi-Core)

Geekbench 5 software suite shows benchmark testing results of the memory performance and speed of the multi-core processor.

Latest comparisons