HiSilicon Kirin 970
HiSilicon Kirin 810
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Comparing HiSilicon Kirin 810 vs HiSilicon Kirin 970

Comparison of video cards HiSilicon Kirin 810 vs HiSilicon Kirin 970 in benchmarks and specifications.

Differences

HiSilicon Kirin 970

Top features of HiSilicon Kirin 970

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  • Higher turbo clock speed
    2.40 GHz left arrow 2.20 GHz
    Around 8% better overclocked clock speed
HiSilicon Kirin 810

Top features of HiSilicon Kirin 810

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  • Higher clock speed
    1.90 GHz left arrow 1.84 GHz
    Around 3% better clock speed
  • Performance per watt
    5 W left arrow 9 W
    About 0.56 times less performance per watt

Specifications

Complete list of technical specifications

CPU generation and family

Let's find out which one of HiSilicon Kirin 970 and HiSilicon Kirin 810 is of a more recent generation, and what segment it belongs to.

Specification Value
Name HiSilicon Kirin 970 left arrow HiSilicon Kirin 810
Segment Mobile left arrow Mobile
Family HiSilicon Kirin left arrow HiSilicon Kirin
Generation 6 left arrow 6
CPU group HiSilicon Kirin 970 left arrow HiSilicon Kirin 810/820

CPU Cores and Base Frequency

In this block we are going to compare HiSilicon Kirin 970 vs HiSilicon Kirin 810 by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

Specification Value
Frequency 1.84 GHz left arrow 1.90 GHz
CPU Cores 8 left arrow 8
Turbo (1 Core) 2.40 GHz left arrow 2.20 GHz
CPU Threads 8 left arrow 8
Turbo (8 Cores) 2.40 GHz left arrow 2.20 GHz
Hyperthreading No left arrow No
Overclocking No left arrow No
Core architecture hybrid (big.LITTLE) left arrow hybrid (big.LITTLE)
A core 4x Cortex-A73 left arrow 2x Cortex-A76
B core 4x Cortex-A53 left arrow 6x Cortex-A55

Internal Graphics

Common specifications for integrated graphics cards in HiSilicon Kirin 970 and HiSilicon Kirin 810 along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

Specification Value
GPU name ARM Mali-G72 MP12 left arrow ARM Mali-G52 MP6
GPU frequency 0.75 GHz left arrow 0.85 GHz
GPU (Turbo) No turbo left arrow No turbo
Execution units 12 left arrow 16
Shader 192 left arrow 288
Max. GPU Memory 2 GB left arrow 4 GB
Max. displays 1 left arrow 2
Generation Bifrost 2 left arrow Bifrost 2
DirectX Version 12 left arrow 12
Technology 16 nm left arrow 12 nm
Release date Q3/2017 left arrow Q1/2018

Hardware codec support

Let's compare the support of video codecs between HiSilicon Kirin 970 and HiSilicon Kirin 810. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

Specification Value
h265 / HEVC (8 bit) Decode / Encode left arrow Decode / Encode
h265 / HEVC (10 bit) Decode / Encode left arrow Decode / Encode
h264 Decode / Encode left arrow Decode / Encode
VP9 Decode / Encode left arrow Decode / Encode
VP8 Decode / Encode left arrow Decode / Encode
AV1 No left arrow No
AVC Decode / Encode left arrow Decode / Encode
VC-1 Decode / Encode left arrow Decode / Encode
JPEG Decode / Encode left arrow Decode / Encode

Memory & PCIe

To choose the best model between HiSilicon Kirin 970 and HiSilicon Kirin 810 you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

Specification Value
Memory type LPDDR4X-2133 left arrow LPDDR4X-2133
Max. Memory 8 GB left arrow 6 GB
ECC No left arrow No
Memory channels 4 left arrow 4

Encryption

AES-NI encryption support for CPUs HiSilicon Kirin 970 and HiSilicon Kirin 810.

Specification Value
AES-NI No left arrow No

Thermal Management

Let's find out what TDP value would be better for HiSilicon Kirin 970 or HiSilicon Kirin 810? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Specification Value
TDP (PL1) 9 W left arrow 5 W

Technical details

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 970 and HiSilicon Kirin 810 CPUs along with a list of ISA extensions.

Specification Value
Instruction set (ISA) ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
Virtualization None left arrow None
L3-Cache 2.00 MB left arrow 1.00 MB
Architecture Cortex-A73 / Cortex-A53 left arrow Cortex-A76 / Cortex-A55
Technology 10 nm left arrow 7 nm
Socket N/A left arrow N/A
Release date Q3/2017 left arrow Q2/2019

Devices using this processor

List of devices based on HiSilicon Kirin 970 and HiSilicon Kirin 810.

Specification Value
Used in Huawei Honor 10Huawei Note 10Huawei PlayHuawei Honor View 10Huawei Mate 10 ProHuawei P20Huawei Nova 3Huawei Nova 4 left arrow Huawei Honor 9X ProHuawei Honor Play 4T ProHuawei MatePad 10.4Huawei Nova 5i ProHuawei P40 Lite

Benchmarks

Real tests HiSilicon Kirin 970 vs HiSilicon Kirin 810

Geekbench 5, 64bit (Single-Core)

Geekbench 5 benchmark is the newest software suit.

Geekbench 5, 64bit (Multi-Core)

Geekbench 5 software suite shows benchmark testing results of the memory performance and speed of the multi-core processor.

iGPU - FP32 Performance (Single-precision GFLOPS)

This test serves for determining the performance of integrated graphics in Intel and AMD processors.

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