HiSilicon Kirin 810 VS Intel Core i7-6700TE

Comparison of video cards HiSilicon Kirin 810 vs Intel Core i7-6700TE in benchmarks and specifications.

Differences Specifications Benchmarks

Differences

Top features of HiSilicon Kirin 810

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More number of cores

8 4

2 times more threads
Performance per watt

5 W 35 W

About 7 0.97 times less performance per watt

Top features of Intel Core i7-6700TE

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Higher clock speed

2.40 GHz 1.90 GHz

Around 21% better clock speed
Higher turbo clock speed

3.40 GHz 2.20 GHz

Around 35 % better overclocked clock speed

Specifications

Complete list of technical specifications

HiSilicon Kirin 810 Intel Core i7-6700TE

CPU generation and family

Let's find out which one of HiSilicon Kirin 810 and Intel Core i7-6700TE is of a more recent generation, and what segment it belongs to.

Specification	Value
Name	HiSilicon Kirin 810 Intel Core i7-6700TE
Segment	Mobile Desktop / Server
Family	HiSilicon Kirin Intel Core i7
Generation	6 6
CPU group	HiSilicon Kirin 810/820 Intel Core i 6000

CPU Cores and Base Frequency

In this block we are going to compare HiSilicon Kirin 810 vs Intel Core i7-6700TE by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

Specification	Value
Frequency	1.90 GHz 2.40 GHz
CPU Cores	8 4
Turbo (1 Core)	2.20 GHz 3.40 GHz
CPU Threads	8 8
Hyperthreading	No Yes
Overclocking	No No
Core architecture	hybrid (big.LITTLE) normal
A core	2x Cortex-A76 --
B core	6x Cortex-A55 --

Internal Graphics

Common specifications for integrated graphics cards in HiSilicon Kirin 810 and Intel Core i7-6700TE along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

Specification	Value
GPU name	ARM Mali-G52 MP6 Intel HD Graphics 530
GPU frequency	0.85 GHz 0.35 GHz
GPU (Turbo)	No turbo 1.00 GHz
Execution units	16 24
Shader	288 192
Max. GPU Memory	4 GB 64 GB
Max. displays	2 3
Generation	Bifrost 2 9
DirectX Version	12 12
Technology	12 nm 14 nm
Release date	Q1/2018 Q3/2015

Hardware codec support

Let's compare the support of video codecs between HiSilicon Kirin 810 and Intel Core i7-6700TE. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

Specification	Value
h265 / HEVC (8 bit)	Decode / Encode Decode / Encode
h265 / HEVC (10 bit)	Decode / Encode Decode
h264	Decode / Encode Decode / Encode
VP9	Decode / Encode Decode
VP8	Decode / Encode Decode / Encode
AV1	No No
AVC	Decode / Encode Decode / Encode
VC-1	Decode / Encode Decode
JPEG	Decode / Encode Decode / Encode

Memory & PCIe

To choose the best model between HiSilicon Kirin 810 and Intel Core i7-6700TE you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

Specification	Value
Memory type	LPDDR4X-2133 DDR3-1600DDR4-2133
Max. Memory	6 GB 64 GB
ECC	No No
Memory channels	4 2
PCIe version	3.0
PCIe lanes	16

Encryption

AES-NI encryption support for CPUs HiSilicon Kirin 810 and Intel Core i7-6700TE.

Specification	Value
AES-NI	No Yes

Thermal Management

Let's find out what TDP value would be better for HiSilicon Kirin 810 or Intel Core i7-6700TE? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Specification	Value
TDP (PL1)	5 W 35 W

Technical details

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 810 and Intel Core i7-6700TE CPUs along with a list of ISA extensions.

Specification	Value
Instruction set (ISA)	ARMv8-A64 (64 bit) x86-64 (64 bit)
Virtualization	None VT-x, VT-x EPT, VT-d
ISA extensions	SSE4.1, SSE4.2, AVX2
L3-Cache	1.00 MB 8.00 MB
Architecture	Cortex-A76 / Cortex-A55 Skylake S
Technology	7 nm 14 nm
Socket	N/A LGA 1151
Release date	Q2/2019 Q4/2015