Differences
 
                        Top features of HiSilicon Kirin 820E 5G
- 
                            Higher clock speed1.84 GHz 1.80 GHz
                            Around -2% better clock speed 1.80 GHz
                            Around -2% better clock speed
 
                        Top features of Qualcomm Snapdragon 860
- 
                            Higher turbo clock speed2.96 GHz 2.22 GHz
                            Around 25 % better overclocked clock speed 2.22 GHz
                            Around 25 % better overclocked clock speed
Specifications
Complete list of technical specificationsCPU generation and family
Let's find out which one of HiSilicon Kirin 820E 5G and Qualcomm Snapdragon 860 is of a more recent generation, and what segment it belongs to.
| Specification | Value | 
|---|---|
| Name | HiSilicon Kirin 820E 5G  Qualcomm Snapdragon 860 | 
| Segment | Mobile  Mobile | 
| Family | HiSilicon Kirin  Qualcomm Snapdragon | 
| Generation | 6  6 | 
| CPU group | HiSilicon Kirin 810/820  Qualcomm Snapdragon 855/860 | 
| Predecessor | --  Qualcomm Snapdragon 855+ | 
CPU Cores and Base Frequency
In this block we are going to compare HiSilicon Kirin 820E 5G vs Qualcomm Snapdragon 860 by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.
| Specification | Value | 
|---|---|
| Frequency | 1.84 GHz  1.80 GHz | 
| CPU Cores | 8  8 | 
| Turbo (1 Core) | 2.22 GHz  2.96 GHz | 
| CPU Threads | 8  8 | 
| Turbo (8 Cores) | 1.84 GHz  2.42 GHz | 
| Hyperthreading | No  No | 
| Overclocking | No  No | 
| Core architecture | hybrid (big.LITTLE)  hybrid (Prime / big.LITTLE) | 
| A core | 3x  Cortex-A76  1x  Kryo 485 Prime | 
| B core | 3x  Cortex-A55  3x  Kryo 485 Gold | 
| C core | --  4x  Kryo 485 Silver | 
Internal Graphics
Common specifications for integrated graphics cards in HiSilicon Kirin 820E 5G and Qualcomm Snapdragon 860 along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.
| Specification | Value | 
|---|---|
| GPU name | ARM Mali-G57 MP6  Qualcomm Adreno 640 | 
| GPU frequency | 0.85 GHz  0.25 GHz | 
| GPU (Turbo) | No turbo  0.68 GHz | 
| Execution units | 6  4 | 
| Shader | 96  384 | 
| Max. GPU Memory | 4 GB  4 GB | 
| Max. displays | 2  1 | 
| Generation | Vallhall 1  5 | 
| DirectX Version | 12  12.0 | 
| Technology | 7 nm  7 nm | 
| Release date | Q2/2020  Q1/2019 | 
Hardware codec support
Let's compare the support of video codecs between HiSilicon Kirin 820E 5G and Qualcomm Snapdragon 860. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.
| Specification | Value | 
|---|---|
| h265 / HEVC (8 bit) | Decode / Encode  Decode / Encode | 
| h265 / HEVC (10 bit) | Decode / Encode  Decode / Encode | 
| h264 | Decode / Encode  Decode / Encode | 
| VP9 | Decode / Encode  Decode / Encode | 
| VP8 | Decode / Encode  Decode / Encode | 
| AV1 | Decode  No | 
| AVC | Decode / Encode  No | 
| VC-1 | Decode / Encode  No | 
| JPEG | Decode / Encode  No | 
Memory & PCIe
To choose the best model between HiSilicon Kirin 820E 5G and Qualcomm Snapdragon 860 you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.
| Specification | Value | 
|---|---|
| Memory type | LPDDR4X-2133  LPDDR4X-2133 | 
| Max. Memory |  16 GB | 
| ECC | No  No | 
| Memory channels | 4  4 | 
Encryption
AES-NI encryption support for CPUs HiSilicon Kirin 820E 5G and Qualcomm Snapdragon 860.
| Specification | Value | 
|---|---|
| AES-NI | No  No | 
Thermal Management
Let's find out what TDP value would be better for HiSilicon Kirin 820E 5G or Qualcomm Snapdragon 860? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.
| Specification | Value | 
|---|---|
| TDP (PL1) | 6 W   | 
Technical details
Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 820E 5G and Qualcomm Snapdragon 860 CPUs along with a list of ISA extensions.
| Specification | Value | 
|---|---|
| Instruction set (ISA) | ARMv8-A64 (64 bit)  ARMv8-A64 (64 bit) | 
| Virtualization | None  None | 
| L2-Cache | --  2.00 MB | 
| L3-Cache | 2.00 MB  3.00 MB | 
| Architecture | Cortex-A76 / Cortex-A55  Kryo 485 | 
| Technology | 7 nm  7 nm | 
| Socket | N/A  N/A | 
| Release date | Q1/2021  Q1/2021 | 
| Part Number | --  SM8150-AC | 
Devices using this processor
List of devices based on HiSilicon Kirin 820E 5G and Qualcomm Snapdragon 860.
| Specification | Value | 
|---|---|
| Used in | Huawei Nova 7 SEHuawei Nova 8  Unknown | 

 
                                                     
                         
                         
                         
                         
                         
                         
                         
                         
                         
                         
                         
                         
                        