HiSilicon Kirin 970
MediaTek Dimensity 700
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Comparing HiSilicon Kirin 970 vs MediaTek Dimensity 700

Comparison of video cards HiSilicon Kirin 970 vs MediaTek Dimensity 700 in benchmarks and specifications.

Differences

HiSilicon Kirin 970

Top features of HiSilicon Kirin 970

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  • Higher turbo clock speed
    2.40 GHz left arrow 2.20 GHz
    Around 8% better overclocked clock speed
MediaTek Dimensity 700

Top features of MediaTek Dimensity 700

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  • Higher clock speed
    2.00 GHz left arrow 1.84 GHz
    Around 8% better clock speed

Specifications

Complete list of technical specifications

CPU generation and family

Let's find out which one of HiSilicon Kirin 970 and MediaTek Dimensity 700 is of a more recent generation, and what segment it belongs to.

Specification Value
Name HiSilicon Kirin 970 left arrow MediaTek Dimensity 700
Segment Mobile left arrow Mobile
Family HiSilicon Kirin left arrow Mediatek Dimensity
Generation 6 left arrow 1
CPU group HiSilicon Kirin 970 left arrow MediaTek Dimensity 700/720/800

CPU Cores and Base Frequency

In this block we are going to compare HiSilicon Kirin 970 vs MediaTek Dimensity 700 by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

Specification Value
Frequency 1.84 GHz left arrow 2.00 GHz
CPU Cores 8 left arrow 8
Turbo (1 Core) 2.40 GHz left arrow 2.20 GHz
CPU Threads 8 left arrow 8
Turbo (8 Cores) 2.40 GHz left arrow 2.00 GHz
Hyperthreading No left arrow No
Overclocking No left arrow No
Core architecture hybrid (big.LITTLE) left arrow hybrid (big.LITTLE)
A core 4x Cortex-A73 left arrow 2x Cortex-A76
B core 4x Cortex-A53 left arrow 6x Cortex-A55

Internal Graphics

Common specifications for integrated graphics cards in HiSilicon Kirin 970 and MediaTek Dimensity 700 along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

Specification Value
GPU name ARM Mali-G72 MP12 left arrow ARM Mali-G57 MP2
GPU frequency 0.75 GHz left arrow 0.85 GHz
GPU (Turbo) No turbo left arrow No turbo
Execution units 12 left arrow 2
Shader 192 left arrow 32
Max. GPU Memory 2 GB left arrow 4 GB
Max. displays 1 left arrow 2
Generation Bifrost 2 left arrow Vallhall 1
DirectX Version 12 left arrow 12
Technology 16 nm left arrow 7 nm
Release date Q3/2017 left arrow Q2/2020

Hardware codec support

Let's compare the support of video codecs between HiSilicon Kirin 970 and MediaTek Dimensity 700. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

Specification Value
h265 / HEVC (8 bit) Decode / Encode left arrow Decode / Encode
h265 / HEVC (10 bit) Decode / Encode left arrow Decode / Encode
h264 Decode / Encode left arrow Decode / Encode
VP9 Decode / Encode left arrow Decode / Encode
VP8 Decode / Encode left arrow Decode / Encode
AV1 No left arrow Decode
AVC Decode / Encode left arrow Decode / Encode
VC-1 Decode / Encode left arrow Decode / Encode
JPEG Decode / Encode left arrow Decode / Encode

Memory & PCIe

To choose the best model between HiSilicon Kirin 970 and MediaTek Dimensity 700 you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

Specification Value
Memory type LPDDR4X-2133 left arrow LPDDR4X-2133
Max. Memory 8 GB left arrow 12 GB
ECC No left arrow No
Memory channels 4 left arrow 2

Encryption

AES-NI encryption support for CPUs HiSilicon Kirin 970 and MediaTek Dimensity 700.

Specification Value
AES-NI No left arrow No

Thermal Management

Let's find out what TDP value would be better for HiSilicon Kirin 970 or MediaTek Dimensity 700? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Specification Value
TDP (PL1) 9 W left arrow

Technical details

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 970 and MediaTek Dimensity 700 CPUs along with a list of ISA extensions.

Specification Value
Instruction set (ISA) ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
Virtualization None left arrow None
L3-Cache 2.00 MB left arrow --
Architecture Cortex-A73 / Cortex-A53 left arrow Cortex-A76 / Cortex-A55
Technology 10 nm left arrow 7 nm
Socket N/A left arrow N/A
Release date Q3/2017 left arrow Q1/2021
Part Number -- left arrow MT6833V/ZA

Devices using this processor

List of devices based on HiSilicon Kirin 970 and MediaTek Dimensity 700.

Specification Value
Used in Huawei Honor 10Huawei Note 10Huawei PlayHuawei Honor View 10Huawei Mate 10 ProHuawei P20Huawei Nova 3Huawei Nova 4 left arrow Unknown

Benchmarks

Real tests HiSilicon Kirin 970 vs MediaTek Dimensity 700

Geekbench 5, 64bit (Single-Core)

Geekbench 5 benchmark is the newest software suit.

Geekbench 5, 64bit (Multi-Core)

Geekbench 5 software suite shows benchmark testing results of the memory performance and speed of the multi-core processor.

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